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Product introduction

Monitor your thin film deposition and vacuum treatment process in real-time with Riber Magnification Inferred Curvature (MIC) tool

Main benefits

In situ stress, bow and curvature measurement, in real time
Set precise growth patterns and monitor deviations
Detect specific growth events and retrieve fundamental knowledge about growth mechanisms
Suitable for various thin films deposition techniques (CVD, MBE, PVD,…) and vacuum treatment process (plasma etching, annealing, quenching …)
Unrivalled curvature sensitivity
Simultaneous spherical and cylindrical bowing, anisotropy measurement
Compatible with low lattice mismatch systems like AlGaAs/GaAs
Thick wafer compatible -up to few mm
Highly stable & alignment-free measurement
Wide-range wavelength source – immune to reflectivity change, no need to adjust exposure time
Immunity to wafer flatness – possible use with patterned wafer

Parameter	Specifications
Curvature range (min – max)	0,0008 – 200 000 km-1
Sensitivity (1-std dev)	Up to 8×10-7m-1 (5×5 matrix, 5s integration/ 500 points –θ= 70°)
Measured standard deviation	8.33×10-6m-1(θ= 0°) // 2.85×10-6m-1(θ= 70°)
Radius range (max – min)	1 250 000 -5×10-3m
Source lifetime	50 000 h
Measurement frequency	100 Hz
Rotation speed range	0-100 rpm
Viewport to sample distance	Adjustable from 75 mm – depending on vacuum chamber dimensions
Flexible installation angle on the reactor	0 – 70°

Find out more about EZ-CURVE here :